数字信号Driver模块采用先进TDBI技术,可在-40℃~150℃的环境下,对所有≤50W集成电路IC(车规级MCU、SoC、FPGA、CPU等不同封装类型)器件进行高温动态测试和寿命评估试验的同时,建立其失效模型,分析其失效机理。
┃ 高温试验箱 | 2;-40℃~150℃;5000W per chamber |
┃ 独立温控 | 24DUT (20W) / 6-9DUT (50W);accuracy:±2℃ |
┃ 容量 | 16*2 Slot;Temperature Zone*2 |
┃ Pattern Zone | 32 |
┃ Slots Pitch | 72mm |
┃ BIB Size | 564mm*610mm |
┃ System Repetition Rate | 20MHz (Maximum) |
┃ Vector Memory | 64M Words |
┃ Error Log | 2K (Per I/O) |
┃ Driver | VH 0.6~4.0V (2 Level) |
┃ Receiver | 0.6~4.0V (VRH,VRL) |
┃ DPS | 8 supplies 0.0~9.5V, 2mV resolution Maximum output: 60A, 240W Accuracy: ±0.3% of output voltage±10mV Ripple & noise:30mV peak to peak |
2 supply 0.0~5.0 V, 2 mV resolution |
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